Electrospell produces functional materials for a range of applications in electronic systems
Functional materials from Electrospell help in dissipating heat from high-power devices, conduct current in flexible electronic systems, produce and clean protective coatings on printed circuit boards, protect underlying materials from ultraviolet radiation and block electromagnetic radiation from entering and leaving sensitive electronic systems.
Functional electronic materials currently available from Electrospell are listed below – the associated photo-links provide more details about individual products.
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Water-based organic conductor Polypolaron is used for a variety of applications where an easily applied and easily removed transparent electrically conductive coating is needed.
Copper-nickel foil Electrimagnet is used in shielding electronics from electric, magnetic and electromagnetic fields.
SolderClean is a mild environmentally-friendly cleaner for tin, copper and solder surfaces on electrical contacts and printed circuit boards.
Tinplate is a simple to use immersion tin plating solution for easily and quickly producing a uniform coating of highly solderable tin on any copper surface.
Acrylic-based ultraviolet absorber Lextran is suitable for general purpose UV blocking applications where high transparency to visible light is required.
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Diamond-based thermal interface material Thermodime is used for efficiently transferring heat from hot components such as power transistors, power LEDs, lasers and power regulators to heat sinks.